使用前请除湿 70度12小时
注意:
1.建议未拆封前储存条件:5℃-30℃,相对湿度60%。
2.袋子开封后,元件若将进行红外线回焊、氧相回焊、或类似的焊线处理必须在:
a.24小时内完成焊接工作。
b.储存低于30%RH。
3.假如不符合2a或2b的条件,则元件必须烘烤。
4.若元件须烘烤,烘烤条件为:65℃±5℃,24小时。
CAUTON:
1.Recommended storage condition:
at 5℃-30℃ and relative humidity 60% RH max.
2.After this bag is opened,devices that will be applied to infrared reflow,vapor-phase reflow,or equivalent soldering process must be:
a.Completed within 24 hours.
b.Stored at less than 30% RH.
3.Devices require baking before mounting,if:
2a or 2b is not met.
4.If baking is required,devices must be bated under below conditions:
24 hours at 65℃ ± 5℃。